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  1. general description the 74ahc240 and 74ahct240 are 8-bit inverting buffer/line drivers with 3-state outputs. these devices can be used as two 4-bit buff ers or one 8-bit buffer. they feature two output enables (1oe and 2oe ), each controlling four of t he 3-state outputs. a high on noe causes the outputs to assume a high-im pedance off-state. inputs are over voltage tolerant. this feature allows the use of th ese devices as translators in mixed voltage environments. 2. features and benefits ? balanced propagation delays ? all inputs have a schmitt-trigger action ? inputs accepts voltages higher than v cc ? for 74ahc240 only: operat es with cmos input levels ? for 74ahct240 only: operates with ttl input levels ? esd protection: ? hbm jesd22-a114f exceeds 2000 v ? cdm jesd22-c101d exceeds 1000 v ? multiple package options ? specified from ? 40 ? c to +85 ? c and from ? 40 ? c to +125 ? c 3. ordering information 74ahc240; 74ahct240 octal buffer/line driver; inverting; 3-state rev. 2 ? 26 november 2010 product data sheet table 1. ordering information type number package temperature range name description version 74ahc240d ? 40 ? c to +125 ? c so20 plastic small outline package; 20 leads; body width 7.5 mm sot163-1 74ahct240d 74ahc240pw ? 40 ? c to +125 ? c tssop20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 74ahct240pw 74ahc240bq ? 40 ? c to +125 ? c dhvqfn20 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 ? 4.5 ? 0.85 mm sot764-1 74AHCT240BQ
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 2 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state 4. functional diagram 5. pinning information 5.1 pinning fig 1. logic symbol fig 2. iec logic symbol mgu779 1a3 1a2 1a1 1a0 2 4 6 8 1 1y0 1y1 18 16 14 12 1y2 1y3 1oe 2a3 2a2 2a1 2a0 17 15 13 11 19 2y0 2y1 3 5 7 9 2y2 2y3 2oe 12 14 2 4 6 8 18 16 1 en mgu778 3 5 11 13 15 17 9 7 19 en (1) this is not a supply pin. the substrate is attached to this pad using conductive die atta ch material. there is no electrical or mechanical requi rement to solder this pad. however, if it is soldered, the solder land should remain floating or be connected to gnd. fig 3. pin configuration so20 and tssop20 fig 4. pin configuration dhvqfn20 74ahc240 74ahct240 1oe v cc 1a0 2oe 2y0 1y0 1a1 2a0 2y1 1y1 1a2 2a1 2y2 1y2 1a3 2a2 2y3 1y3 gnd 2a3 001aal192 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 001aal193 74ahc240 74ahct240 gnd (1) transparent top view 1y3 1a3 2y3 2a2 2y2 1y2 1a2 2a1 2y1 1y1 1a1 2a0 2y0 1y0 1a0 2oe gnd 2a3 1oe v cc 9 12 8 13 7 14 6 15 5 16 4 17 3 18 2 19 10 11 1 20 terminal 1 index area
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 3 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state 5.2 pin description 6. functional description [1] h = high voltage level; l = low voltage level; x = don?t care; z = high-impedance off-state. 7. limiting values [1] the minimum input and output voltage ratings may be exceed ed if the input and output current ratings are observed. [2] for so20 package: above 70 ? c the value of p tot derates linearly with 8.0 mw/k. for tssop20 package: above 60 ? c the value of p tot derates linearly with 5.5 mw/k. for dhvqfn20 package: above 60 ? c the value of p tot derates linearly with 4.5 mw/k. table 2. pin description symbol pin description 1oe 1 output enable input (active low) 2oe 19 output enable input (active low) 1a0, 1a1, 1a2, 1a3 2, 4, 6, 8 data input 2a0, 2a1, 2a2, 2a3 17, 15, 13, 11 data input 1y0, 1y1, 1y2, 1y3 18, 16, 14, 12 data output 2y0, 2y1, 2y2, 2y3 3, 5, 7, 9 data output gnd 10 ground (0 v) v cc 20 power supply table 3. function table [1] control input output noe nan nyn llh lhl hxz table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +7.0 v v i input voltage ? 0.5 +7.0 v i ik input clamping current v i < ? 0.5 v [1] ? 20 - ma i ok output clamping current v o < ? 0.5 v or v o >v cc +0.5v [1] - ? 20 ma i o output current v o = ? 0.5 v to (v cc +0.5v) - ? 25 ma i cc supply current - 75 ma i gnd ground current ? 75 - ma t stg storage temperature ? 65 +150 ?c p tot total power dissipation t amb = ? 40 ? c to +125 ?c [2] - 500 mw
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 4 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state 8. recommended operating conditions 9. static characteristics table 5. recommended operating conditions symbol parameter conditions min typ max unit 74ahc240 v cc supply voltage 2.0 5.0 5.5 v v i input voltage 0 - 5.5 v v o output voltage 0 - v cc v t amb ambient temperature ? 40 +25 +125 ?c ? t/ ? v input transition rise and fall rate v cc = 3.3 v ? 0.3 v - - 100 ns/v v cc = 5 v ? 0.5v --20ns/v 74ahct240 v cc supply voltage 4.5 5.0 5.5 v v i input voltage 0 - 5.5 v v o output voltage 0 - v cc v t amb ambient temperature ? 40 +25 +125 ?c ? t/ ? v input transition rise and fall rate v cc = 5 v ? 0.5v --20ns/v table 6. static characteristics at recommended operating conditions; voltag es are referenced to gnd (ground = 0 v). symbol parameter conditions 25 ?c ? 40 ? c to +85 ?c ? 40 ? c to +125 ?c unit min typ max min max min max 74ahc240 v ih high-level input voltage v cc = 2.0 v 1.5 - - 1.5 - 1.5 - v v cc = 3.0 v 2.1 - - 2.1 - 2.1 - v v cc = 5.5 v 3.85 - - 3.85 - 3.85 - v v il low-level input voltage v cc = 2.0 v - - 0.5 - 0.5 - 0.5 v v cc = 3.0 v - - 0.9 - 0.9 - 0.9 v v cc = 5.5 v - - 1.65 - 1.65 - 1.65 v v oh high-level output voltage v i = v ih or v il i o = ? 50 ? a; v cc = 2.0 v 1.9 2.0 - 1.9 - 1.9 - v i o = ? 50 ? a; v cc = 3.0 v 2.9 3.0 - 2.9 - 2.9 - v i o = ? 50 ? a; v cc = 4.5 v 4.4 4.5 - 4.4 - 4.4 - v i o = ? 4.0 ma; v cc = 3.0 v 2.58 - - 2.48 - 2.40 - v i o = ? 8.0 ma; v cc = 4.5 v 3.94 - - 3.80 - 3.70 - v v ol low-level output voltage v i = v ih or v il i o = 50 ? a; v cc = 2.0 v - 0 0.1 - 0.1 - 0.1 v i o = 50 ? a; v cc = 3.0 v - 0 0.1 - 0.1 - 0.1 v i o = 50 ? a; v cc = 4.5 v - 0 0.1 - 0.1 - 0.1 v i o = 4.0 ma; v cc = 3.0 v - - 0.36 - 0.44 - 0.55 v i o = 8.0 ma; v cc = 4.5 v - - 0.36 - 0.44 - 0.55 v
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 5 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state i i input leakage current v i =5.5vorgnd; v cc = 0 v to 5.5 v - - 0.1 - 1.0 - 2.0 ? a i oz off-state output current v i =v ih or v il ; v o =v cc or gnd; v cc =5.5v -- ? 0.25 - ? 2.5 - ? 10.0 ? a i cc supply current v i =v cc or gnd; i o = 0 a; v cc =5.5v --4.0- 40 - 80 ? a c i input capacitance v i =v cc or gnd - 3 10 - 10 - 10 pf c o output capacitance -4- - - - -pf 74ahct240 v ih high-level input voltage v cc = 4.5 v to 5.5 v 2.0 - - 2.0 - 2.0 - v v il low-level input voltage v cc = 4.5 v to 5.5 v - - 0.8 - 0.8 - 0.8 v v oh high-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = ? 50 ? a 4.4 4.5 - 4.4 - 4.4 - v i o = ? 8.0 ma 3.94 - - 3.80 - 3.70 - v v ol low-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = 50 ? a - 0 0.1 - 0.1 - 0.1 v i o = 8.0 ma - - 0.36 - 0.44 - 0.55 v i i input leakage current v i =5.5vorgnd; v cc = 0 v to 5.5 v - - 0.1 - 1.0 - 2.0 ? a i oz off-state output current v i =v ih or v il ; v o =v cc or gnd per input pin; other inputs at v cc or gnd; i o =0 a; v cc =5.5v -- ? 0.25 - ? 2.5 - ? 10.0 ? a i cc supply current v i =v cc or gnd; i o = 0 a; v cc =5.5v --4.0- 40 - 80 ? a ? i cc additional supply current per input pin; v i =v cc ? 2.1 v; other pins at v cc or gnd; i o =0 a; v cc = 4.5 v to 5.5 v --1.35- 1.5 - 1.5ma c i input capacitance v i =v cc or gnd - 3 10 - 10 - 10 pf c o output capacitance -4- - - - -pf table 6. static characteristics ?continued at recommended operating conditions; voltag es are referenced to gnd (ground = 0 v). symbol parameter conditions 25 ?c ? 40 ? c to +85 ?c ? 40 ? c to +125 ?c unit min typ max min max min max
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 6 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state 10. dynamic characteristics table 7. dynamic characteristics voltages are referenced to gnd (ground = 0 v); for test circuit see figure 7 . symbol parameter conditions 25 ?c ? 40 ? c to +125 ? c unit min typ [1] max min max (85 ?c) max (125 ?c) 74ahc240 t pd propagation delay nan to nyn; see figure 5 [2] v cc = 3.0 v to 3.6 v; c l = 15 pf - 3.9 7.5 1.0 8.6 10.8 ns v cc = 3.0 v to 3.6 v; c l = 50 pf - 5.8 11.0 1.0 12.5 15.6 ns v cc = 4.5 v to 5.5 v; c l = 15 pf - 2.8 4.8 1.0 5.7 7.1 ns v cc = 4.5 v to 5.5 v; c l = 50 pf - 4.2 7.3 1.0 8.5 10.6 ns t en enable time noe to nyn; see figure 6 [2] v cc = 3.0 v to 3.6 v; c l = 15 pf - 4.4 10.0 1.0 12.0 19.4 ns v cc = 3.0 v to 3.6 v; c l = 50 pf - 5.8 13.5 1.0 15.5 19.4 ns v cc = 4.5 v to 5.5 v; c l = 15 pf - 3.1 6.5 1.0 7.7 12.5 ns v cc = 4.5 v to 5.5 v; c l = 50 pf - 4.1 8.5 1.0 10.0 12.5 ns t dis disable time noe to nyn; see figure 6 [2] v cc = 3.0 v to 3.6 v; c l = 15 pf - 5.3 9.0 1.0 10.0 18.1 ns v cc = 3.0 v to 3.6 v; c l = 50 pf - 8.9 13.0 1.0 14.5 18.1 ns v cc = 4.5 v to 5.5 v; c l = 15 pf - 3.9 5.8 1.0 6.5 8.1 ns v cc = 4.5 v to 5.5 v; c l = 50 pf - 6.2 8.7 1.0 9.5 11.8 ns c pd power dissipation capacitance v i = gnd to v cc ; c l =50pf; f i =1mhz [3] -9 -- - -pf
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 7 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state [1] typical values are measured at nominal supply voltage (v cc = 3.3 v and v cc = 5.0 v). [2] t pd is the same as t plh and t phl ; t en is the same as t pzh and t pzl ; t dis is the same as t plz and t phz . [3] c pd is used to determine the dynamic power dissipation (p d in ? w). p d =c pd ? v cc 2 ? f i ? n + ? (c l ? v cc 2 ? f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; ? (c l ? v cc 2 ? f o ) = sum of outputs. 11. waveforms 74ahct240 t pd propagation delay nan to nyn; see figure 5 [2] v cc = 4.5 v to 5.5 v; c l = 15 pf - 3.0 5.8 1.0 6.8 8.5 ns v cc = 4.5 v to 5.5 v; c l = 50 pf - 4.4 8.4 1.0 9.5 11.9 ns t en enable time noe to nyn; see figure 6 [2] v cc = 4.5 v to 5.5 v; c l = 15 pf - 3.4 7.5 1.0 9.0 14.4 ns v cc = 4.5 v to 5.5 v; c l = 50 pf - 4.5 9.5 1.0 11.5 14.4 ns t dis disable time noe to nyn; see figure 6 [2] v cc = 4.5 v to 5.5 v; c l = 15 pf - 3.9 6.1 1.0 6.7 8.3 ns v cc = 4.5 v to 5.5 v; c l = 50 pf - 6.2 8.7 1.0 9.2 11.5 ns c pd power dissipation capacitance v i = gnd to v cc ; c l =50pf; f i =1mhz [3] -9 -- - -pf table 7. dynamic characteristics ?continued voltages are referenced to gnd (ground = 0 v); for test circuit see figure 7 . symbol parameter conditions 25 ?c ? 40 ? c to +125 ? c unit min typ [1] max min max (85 ?c) max (125 ?c) measurement points are given in table 8 . v ol and v oh are typical voltage output drop that occur with the output load. fig 5. propagation delay input (nan) to output (nyn) mgu781 nan input nyn output t phl t plh gnd v i v m v m v m v m v oh v ol
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 8 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state measurement points are given in table 8 . v ol and v oh are typical voltage output drop that occur with the output load. fig 6. enable and disable times mgu782 t plz t phz outputs disabled outputs enabled v y v x outputs enabled nyn output low-to-off off-to-low nyn output high-to-off off-to-high noe input v i v ol v oh v cc v m gnd gnd t pzl t pzh v m v m table 8. measurement points type input output v m v m v x v y 74ahc240 0.5v cc 0.5v cc v ol + 0.3 v v oh ? 0.3 v 74ahct240 1.5 v 0.5v cc v ol + 0.3 v v oh ? 0.3 v
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 9 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state test data is given in table 9 . definitions test circuit: r t = termination resistance should be equal to output impedance z o of the pulse generator. c l = load capacitance including jig and probe capacitance. r l = load resistance. s1 = test selection switch. fig 7. load circuitry for switching times v m v m t w t w 10 % 90 % 0 v v i v i negative pulse positive pulse 0 v v m v m 90 % 10 % t f t r t r t f 001aad983 dut v cc v cc v i v o r t r l s1 c l open g table 9. test data type input load s1 position v i t r , t f c l r l t phl , t plh t pzh , t phz t pzl , t plz 74ahc240 v cc 3.0 ns 15 pf, 50 pf 1 k ? open gnd v cc 74ahct240 3.0 v 3.0 ns 15 pf, 50 pf 1 k ? open gnd v cc
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 10 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state 12. package outline fig 8. package outline sot163-1 (so20) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z ywv references outline version european projection issue date iec jedec jeita mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 sot163-1 10 20 w m b p detail x z e 11 1 d y 0.25 075e04 ms-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale x a a 1 a 2 h e l p q e c l v m a (a ) 3 a so20: plastic small outline package; 20 leads; body width 7.5 mm sot163-1 99-12-27 03-02-19
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 11 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state fig 9. package outline sot360-1 (tssop20) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot360-1 mo-153 99-12-27 03-02-19 w m b p d z e 0.25 11 0 20 11 pin 1 index a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 a max. 1.1
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 12 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state fig 10. package outline sot764-1 (dhvqfn20) terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 4.6 4.4 d h 3.15 2.85 y 1 2.6 2.4 1.15 0.85 e 1 3.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot764-1 mo-241 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot764-1 dhvqfn20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 29 19 12 11 10 1 20 x d e c b a terminal 1 index area ac c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1) 02-10-17 03-01-27
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 13 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state 13. abbreviations 14. revision history table 10. abbreviations acronym description cdm charge device model cmos complementary metal oxide semiconductor dut device under test esd electrostatic discharge hbm human body model ttl transistor-transistor logic table 11. revision history document id release date data sheet status change notice supersedes 74ahc_ahct240 v.2 20101126 product data sheet - 74ahc_ahct240 v.1 modifications: ? figure note [1] of figure 4 : changed. 74ahc_ahct240 v.1 20100111 product data sheet - -
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 14 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 15.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 15.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qua lified for use in automotive applications. the product is not desi gned, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be ex pected to result in personal injury, death or severe property or environmental dam age. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
74ahc_ahct240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 2 ? 26 november 2010 15 of 16 nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from national authorities. 15.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 16. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors 74ahc240; 74ahct240 octal buffer/line driver ; inverting; 3-state ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 26 november 2010 document identifier: 74ahc_ahct240 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 functional description . . . . . . . . . . . . . . . . . . . 3 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 recommended operating conditions. . . . . . . . 4 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 4 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 15 legal information. . . . . . . . . . . . . . . . . . . . . . . 14 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 15.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16 contact information. . . . . . . . . . . . . . . . . . . . . 15 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16


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